OKAMOTO GNX200BH Wafer grinder

Characteristics of OKAMOTO GNX200BH SiC silicon carbide /GaN gallium nitride wafer thinning machine;

• Suitable for thinning hard materials:
• GNX200BH is an automatic thinning equipment for grinding superhard materials. It adopts high-power spindle and high-rigidity castings, which can greatly reduce the machining tolerance.
• GNX200BH is excellent in thinning/grinding/grinding wafers made of new hard materials such as SiC silicon carbide wafers and GaN gallium nitride wafers.

Specification parameters of OKAMOTO GNX200BH SiC silicon carbide /GaN gallium nitride wafer thinning machine;