TAMURA RMA-20-31 Lead-tin paste
Brief introduction of lead-tin paste characteristics of RMA-20-31 in TAMURA Tamura;
- Tin beads around the chip are basically not generated.
- After reflow soldering, the flux is evenly coated, so there will be no channel defect.
- Good welding performance, showing excellent wettability for various parts.
- The viscosity will not change with time during continuous printing, and it has good stability.
TAMURA Tamura RMA-20-31 has lead-tin paste specification parameters:
| name of an article | RMA-20-31 | test method |
| Alloy composition (%) | Sn62.8/Pb36.8/Ag0.4 | JIS Z 3282(1986) |
| melting point (℃) | 179~183 | DSC determination |
| Solder particle size (μm) | 20~38 | Laser analysis |
| Tin powder shape | sphericity | JIS Z 3284(1994) |
| Flux content (%) | 9.8±0.3% | JIS Z 3284(1994) |
| Halogen content (%) | 0.0 | JIS Z 3197(1994) |
| viscosity (Pa·s) | 160-190 | JIS Z 3284(1994) |
