TAMURA SQ-20-27 has lead solder paste.
Brief introduction to the characteristics of lead-tin paste in TAMURA Tamura SQ-20-27;
- It also shows good welding performance on tiny parts with a spacing of 0.3 mm.
- The viscosity will not change with time during continuous printing, and it has good stability.
- When preheating, it will not collapse, so it will not bridge.
- Effective prevention of tombstone phenomenon
- Good stability and long-term storage viscosity will not change.
TAMURA Tamura SQ-20-27 has specifications and parameters of lead-tin paste:
| name of an article | SQ-20-27 | test method |
| Alloy composition (%) | Sn62.8/Pb36.8/Ag0.4 | JIS Z 3282(1986) |
| Melting point (℃) | 179~183 | DSC determination |
| Solder particle size (μm) | 20~38 | Laser analysis |
| Flux content (%) | 10 | JIS Z 3284 |
| Halogen content (%) | 0.20 | JIS Z 3284 |
| viscosity (Pa·s) | 200 | JIS Z 3284 |
