TAMURA SQ-20-49 Lead-tin paste
Brief introduction to the characteristics of lead-tin paste in TAMURA Tamura SQ-20-49;
- Tin beads around the chip are basically not generated.
- After reflow soldering, the flux is evenly coated, so there will be no channel defect.
- Good welding performance, showing excellent wettability for various parts.
- The viscosity will not change with time during continuous printing, and it has good stability.
TAMURA Tamura SQ-20-49 has lead-tin paste specification parameters:
| name of an article | SQ-20-49 | test method |
| Alloy composition (%) | Sn62.8/Pb36.8/Ag0.4 | JIS Z 3282(1986) |
| melting point (℃) | 179~183 | DSC determination |
| Solder particle size (μm) | 15~41 | Laser analysis |
| Tin powder state | sphericity | JIS Z 3284(1994) |
| Flux content (%) | 9.8 | JIS Z 3284(1994) |
| Halogen content (%) | 0.19 | JIS Z 3197(1999) |
| viscosity (Pa·s) | 180 | JIS Z 3284(1994) |
