TAMURA RMA-012-FP Lead-tin paste
TAMURA has the characteristics of lead-tin paste RMA-012-FP:
- Can better improve the "monument" phenomenon.
- A stable FILET can be formed on the end face of QFP.
- Excellent solderability, especially for crystal components, etc., can play a satisfactory role in tin dipping.
- Tin beads around the chip are basically not generated.
TAMURA has the specification parameters of lead solder paste RMA-012-FP.
| project |
RMA-012-FP |
Experimental method |
| alloying component |
62.8Sn/0.4Ag/36.8Pb |
JIS Z 3282(1986) |
| melting point |
179~183 ℃ |
Using DSC detection |
| Solder particle size |
22~45μm |
Using laser light reflection method |
| Flux content |
9.5% |
JIS Z 3284(1994) |
| Halogen content |
0.13% |
JIS Z 3197(1999) |
| viscosity |
200Pa.s |
JIS Z 3284(1994) |
