TAMURA RMA-010-FP Lead-tin paste
Brief introduction of lead-tin paste characteristics of RMA-010-FP in Tamura Tamura;
- Suitable for printing on lines with a spacing of 0.3 ~ 1 mm.
- A stable FILET can be formed on the end face of QFP.
- Excellent solderability, especially for crystal components, etc., can play a satisfactory role in tin dipping.
- Tin beads around the chip are basically not generated.
- It has excellent demoulding performance and is very suitable for printing precision parts.
Tamura Tamura RMA-010-FP has lead solder paste specification parameters:
| name of an article |
RMA-010-FP |
test method |
| Alloy composition (%) |
Sn63/Pb37 |
JIS Z 3282 |
| Melting point (℃) |
183 |
DSC determination |
| Solder particle size (μm) |
22~45 |
Laser refraction method |
| Flux content (%) |
9.5 |
IPC-TM-650 |
| Halogen content (%) |
0.13 |
JIS Z 3284及MIL-F-14256F |
| Viscosity (Pa·s) |
210 |
JIS Z 3284 |
