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Halogen-free solder paste
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TAMURA TLF-204F-SHK Lead-free and halogen-free solder paste
TAMURA TLF-204F-SHK Lead-free and halogen-free solder paste
Brief introduction of TAMURA Tamura TLF-204F-SHK lead-free and halogen-free solder paste;
- Lead-free (tin/silver/copper series) solder alloy is adopted.
- Small viscosity change during continuous printing and stable printing quality.
- Good wettability is obtained in the fine tuning mode of CSP.
- There is no plunge during preheating.
- Excellent solderability even at high peak temperature.
- Excellent reliability even if flux residue is not cleaned.
TAMURA Tamura TLF-204F-SHK Lead-free and Halogen-free Solder Paste Specifications:
| project | trait | Experimental method |
| alloying component | Sn96.5/Ag3.0/Cu0.5 | JIS Z 3282(1999) |
| melting point | 216～220℃ | Using DSC detection |
| Tin powder particle size | 10~30μｍ | Using laser reflection method |
| Tin powder shape | sphericity | JIS Z 3284(1994) |
| Flux content | 12.2% | JIS Z 3284(1994) |
| chlorinity | 0.0 % | JIS Z 3197(1999) |
| viscosity | 210Pa·s |
JIS Z 3284(1994) Malcom PCU viscometer 25℃ |
| Aqueous solution resistance test | More than 1×104Ω･cm | JIS Z 3197(1999) |
| Insulation resistance test | More than 1×108Ω | JIS Z 3284(1994) |
| Fluidity test | Less than 0.20mm | The solder paste was printed on a porcelain substrate and heated at 150℃ for 60 seconds, and the flow range was measured from the width of the solder before and after heating.STD-092b※ |
| Tin ball test | Almost Wuxi ball occurs. |
The solder paste was printed on a porcelain substrate, melted and heated, and observed with a 50-fold microscope. STD-009e※ |
| Solder diffusion test | More than 75% | JIS Z 3197(1986) |
| Copper corrosion test | Non-corrosive | JIS Z 3197(1986) |
| Viscosity test of solder paste residue after reflow | qualified | JIS Z 3284(1994) |
