TAMURA GD204JL-MPB01 Low Alpha halogen-free solder paste
Brief introduction of Tamura GD204JL-MPB01 lead-free solder paste;
- Use tiny solder powder of 8m or less.
- It is very suitable for forming solder joints with almost no gaps.
- The residual flux after reflow can be removed by semi-aqueous cleaning solvent.
Specification parameters of TAMURA lead-free solder paste GD204JL-MPB01
project |
GD204JL-MPB01 |
Experimental method |
alloying component |
Sn96.5/Ag3/Cu0.5 |
JIS Z 3282 (1999) |
melting point |
216~220°C |
DSC |
Solder particle size |
2~8μm |
Using laser light reflection method |
Tin powder shape | sphericity |
JIS Z 3284-2(2014) |
Flux content |
11.40% |
JIS Z 3197 (2012) |
Chlorine content* |
Chlorine content* |
JIS Z 3197(2012) |
viscosity |
260Pa.s |
JIS Z 3284 (1994) Malcom PCU viscometer 25℃ |