TAMURA TLF-204-NH(20-36) Lead-free and halogen-free solder paste
Brief introduction of TAMURA Tamura TLF-204-NH(20-36) lead-free and halogen-free solder paste;
- Lead-free (tin/silver/copper series) solder alloy is adopted.
- Use halogen-free flux
- The viscosity changes little during continuous printing, and the printing quality is stable.
- It has good solderability even when reflowing in air.
- Excellent solderability even at high peak temperature.
- NH _ (20-36) has excellent reliability even if the flux residue is not cleaned.
TAMURA Tamura TLF-204-NH(20-36) Lead-free and Halogen-free Solder Paste Specifications:
| project |
trait（TLF-204-NH(20-36)） |
Experimental method |
| alloying component |
Sn96.5/Ag3.0/Cu0.5 |
JIS Z 3282(1999) |
|
melting point (℃) |
216～220℃ |
Using DSC detection |
|
Solder particle size (μm) |
20～36um |
Using laser reflection method |
| Tin powder shape | sphericity |
JIS Z 3284(1994) |
| Flux content |
11.8% |
JIS Z 3284(1994) |
| chlorinity |
0.0% (In flux) |
JIS Z 3197(1999) |
| viscosity |
180Pa.s |
JIS Z 3284(1994) Malcom PCU viscometer 25℃ |
| Aqueous solution resistance test |
More than 1×104Ω.cm |
JIS Z 3197(1999) |
| Insulation resistance test |
More than 1×109Ω |
JIS Z 3284(1994) |
| Fluidity test |
Less than 0.20mm |
Solder paste was printed on a porcelain substrate with a thickness of 15. 0℃ for 60 seconds, from before and after solder heating. The width of the measured flow amplitude. STD-092b Note |
| Tin ball test | Almost Wuxi ball occurs. |
Printing the solder paste on the porcelain substrate, melting and adding. After heating, observe it with a 50 times microscope. STD-009e Note |
| Solder diffusion test |
More than 70% |
JIS Z 3197(1986) |
| Copper corrosion test | Non-corrosive |
JIS Z 3197(1986) |
| Viscosity test of solder paste residue after reflow | qualified |
JIS Z 3284(1994) |
Note Tamura test method (numerical value is not guaranteed value)
