Home Page
ꄲ
welding material
ꄲ
Lead-free solder paste (special alloy)
ꄲ
TAMURA TLF-286-GTS-VR5 high reliability lead-free solder paste
TAMURA TLF-286-GTS-VR5 high reliability lead-free solder paste
Brief introduction of Tamura TLF-286-GTS-VR5 lead-free solder paste;
- Even under high temperature reflow, it shows good heat resistance, high reliability and high reliability solder paste, excellent effect of preventing parts from breaking, and the quality of cold and hot impact cyclic welding remains the same.
- Pb-free (Sn/Ag/Cu/Bi/Sb system) solder alloy is used.
- Excellent insulation characteristic can be obtained under the conditions of high temperature and high humidity.
- Crack resistant flux residues.For the N2 reflow.
Specification parameters of TAMURA lead-free solder paste TLF-286-GTS-VR5
project |
TLF-286-GTS-VR5 |
Experimental method |
alloying component |
Sn / Ag3.0 / Cu0.7 / Bi3.2 / Sb3.0 |
JIS Z 3910(2017) |
melting point |
209~224℃ |
JIS Z 3198-1(2014) |
Solder particle size |
20~38μm |
Using laser light reflection method |
Tin powder shape | sphericity |
JIS Z 3284-2(2014) |
Flux content |
11.5% |
JIS Z 3197(2012) |
Halogen content |
0% |
JIS Z 3197(2012) |
viscosity |
210Pa.s |
JIS Z 3284-3(2014) Malcom PCU viscometer 25℃ |