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TAMURA LF-204-GD13S Lead-free solder paste low alpha Ray

Introduction of low alpha Ray lead-free solder paste LF-204-GD13S;

  • Lead-free solder paste LF-204-GD13S is a low alpha Ray solder paste corresponding to N2 reflow soldering, which is composed of high-reliability flux and lead-free spherical solder alloy powder, and is used to form solder joints. The solder paste has excellent fine pattern printing shape, and it is also excellent in removing solder paste residue with semi-water-based cleaning agent.

Low alpha Ray lead-free solder paste LF-204-GD13S features:

  • Even in the case of fine patterns of 125μmφ, it has excellent shape printing performance.
  • The residual flux after reflow soldering can be removed by semi-water-based cleaning agent.
  • Any existing equipment can be used to form solder joints.

 

Low alpha Ray lead-free solder paste LF-204-GD13S specification parameters:

project

trait(LF-204-GD13S)

alloying component

Sn96.5/Ag3.0/Cu0.5

Melting point (℃)

216~220℃

Solder particle size (μm)

2~6μm

Tin powder content

12.6%

chlorinity

0.0%

viscosity

300Pa.s

Tin ball test Less solder balls occur.
Solder diffusion test More than 80%

 

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