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TAMURA TLF-204-171AK Lead-free solder paste

TAMURA lead-free solder paste TLF-204-171AK Features:

  • TLF-204-171AK is a lead-free (tin/silver/copper-based) solder alloy for clean-free lead-free solder paste.
  • Spherical tin powder with little oxide and special flux are also refined, so the viscosity changes little with time during continuous printing and the printing quality is stable.
  • Good wettability to parts and pads, and can effectively improve the solderability of BGA;
  • TLF-204-171AK can work at high temperature and has excellent weldability.
  • Even if the flux residue on the board is not removed, it has excellent reliability.
  • Lead-free, which is of great help to the environment and workplace protection.

 

Tamura Tamura TTLF-204-171AK Lead-free Solder Paste Specifications:

project

trait(TLF-204-171AK)

Experimental method
alloying component Tin 96.5/ Silver 3.0/ Copper 0.5

JIS Z 3282(1999)

melting point (℃)

216~220℃

Using DSC detection

Solder particle size (μm)

20~38 μm

Using laser light reflection method
Tin powder shape sphericity

JIS Z 3282 (19994)

Flux content

11.5%

JIS Z 3284(1994)

chlorinity

0.0%(in flux)

JIS Z 3197(1999)

viscosity

170Pa.s

JIS Z 3284(1994)

Malcom PCU Type a viscometer 25℃

Aqueous solution resistance test

More than 1×104Ω.cm 

JIS Z 3197(1999)

Insulation resistance test

More than 1×109Ω 

JIS Z 3284(1994),

Type 2 substrate

Reflow: heating by reflow oven.

Fluidity test Below 0.20mm

Solder paste was printed on a porcelain substrate with a thickness of 15.

0℃ for 60 seconds, from before and after solder heating.

The width of the measured flow amplitude.

STD-092b Note

Tin ball test Almost Wuxi ball occurs.

Printing the solder paste on the porcelain substrate, melting and adding.

After heating, observe it with a 50 times microscope.

STD-009e Note

Solder diffusion test

More than 75% 

JIS Z 3197(1986)

Copper corrosion test Non-corrosive situation

JIS Z 3197(1986)

 

Note Tamura test method (numerical value is not guaranteed value)

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