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welding material
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Lead-free solder paste (SAC305)
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TAMURA TLF-204-MDS-2 Lead-free solder paste
TAMURA TLF-204-MDS-2 Lead-free solder paste
TAMURA lead-free solder paste TLF-204-MDS-2 features:
- Viscosity stability over time
- Stable printability
- For excellent wettability of each preheating
- Improve preheating collapse
- Reliability (j-STD class: l0)
- 0.5 mmbga non-wetting correspondence
Specification parameters of TAMURA lead-free solder paste TLF-204-MDS-2
| project |
TLF-204-MDS-2 |
Experimental method |
| alloying component |
Sn96.5/Ag3.0/Cu0.5 |
—— |
| Melting point (℃) |
216/220 |
According to DSC |
|
Solder particle size (μm) |
20~36 |
—— |
| Flux content |
10.9 |
JIS Z 3284(1994) |
| viscosity |
195 |
|
| Thixotropic index |
0.55 |
|
| chlorinity |
0.0 |
STD-018b |
