MITO DENKO MUV152020PAR UV tape
MITO DENKO UV tape features:
- A cutting tape based on the same-sex polyolefin is coated with ultraviolet pressure-sensitive adhesive (PSA). Very suitable for cutting purposes, and can be easily picked up after ultraviolet irradiation.
- Suitable for non-bump wafer grinding and cutting various substrates (such as QFN, DFN, etc.).
Test method of MITO DENKO UV tape:
- Stickiness: after 20 minutes of gluing, roll it back and forth with a 2kg roller.
- Then the adhesive tape is attached to each adherend, and the peeling mode is 90℃ and 300mm/min.
- UV irradiation: use high-pressure mercury lamp or LED lamp
- Irradiation condition: 300mJ/cm2. (intensity: about 75mW/cm~2×4 seconds, wavelength: 365nm)
- MD: vertical direction TD: horizontal direction
MITO DENKO UV tape specification parameters:
| project | numerical value | |
| thickness | Tape thickness |
170um |
| substratum |
20um |
|
|
stickiness（N/10mm） |
BA-SUS |
Before UV 4.50 After UV 0.10 |
|
BA-SUS |
Before UV 4.10 After UV 0.12 |
|
| Yes, glass |
Before UV 4.30 After UV 0.20 |
|
|
tensile-strength [TD/MD] |
25/27 N/10mm |
|
|
tractility [TD/MD] |
800/760% |
|
