MITO DENKO MIT-200 Temporary wafer bonding adhesive

MITO DENKO Mito Electric Wafer Temporary Bonding Adhesive MIT-200 Features:

• The wafer can be thinned to an ultra-thin sheet and the process flow on the back of the wafer can be supported.
• Has a certain degree of high temperature tolerance.
• Compatible with common semiconductor reagents.
• Conform to the mainstream semiconductor process flow
• UV curing adhesive MIT-200 is a 100% solvent-free acrylic UV curing adhesive.
• Special temporary bonding adhesive for glass and silicon wafer for WSS wafer temporary bonding and debonding scheme.

MITO DENKO Mito Electric Wafer Temporary Bonding Adhesive MIT-200 Specifications: