JEL MCR3160C 3-axis cylindrical coordinate clean wafer handling robot arm

Characteristics of 3-axis cylindrical clean wafer handling robot MCR3160C;

• 300mm wafer for ultra-clean and dust-free room corresponds to MCR3000C series.
• Suitable for wafer handling in semiconductor production equipment and testing equipment.
• The whole shaft adopts AC servo motor to meet the demand of high-speed transportation.
• It has a better cost performance advantage than MHR series.
• Standard arm length of mechanical arm: 160mm, 200mm.
• To meet the equipment requirements, you can choose the base fixing method or the flange fixing method.
• Equipped with action monitor
• Control communication mode: RS232C and parallel port I/O mode.
• AC servo motor with absolute encoder specification for the whole shaft.
• S-curve acceleration and deceleration control mode can transport semiconductor wafers at high speed and high precision.
• Wafer fixing methods: vacuum adsorption type, bottom support type, edge clamping type and Bernoulli non-contact type.
• Finger material: CFRP (carbon fiber), aluminum alloy, high-purity ceramics and other optional materials.
• Fingers can be provided according to the types of objects to be transported, equipment layout and other requirements.

Basic parameters of 3-axis cylindrical coordinate clean wafer handling robot MCR3160C;