SINTAIKE STK-6200 Fully Automatic Wafer Taper
STK-6200_Fully Automatic Wafer Taper feature：
- Advanced ESD roller taping
- Fully automatic tape feeding & mounting
- JEL Robot
- Wafer position & warpage intelligent mapping
- JEL Alignment
- Heating ESD contact wafer chuck to handle various wafers (Optional)
- Wafer cassette loading & unloading
- Standard industrial PC control with 17” touch panel LCD
- Made of full aluminium profiles frame
- Built-in Ion Blower for ESD protection
STK-6200_Fully Automatic Wafer Taper Performances：
|
Wafer Yield |
>= 99.9 % (not include damage wafers) |
|
Taping Quality |
No Air Bubble (not include particle bubble) |
|
UPH |
>= 70 PCs Wafer |
|
MTBF |
> 500 Hours |
|
MTTR |
< 1 Hour |
|
Down Time |
< 3% |
|
Conversion Time |
<= 15 Minutes |
STK-6200_Fully Automatic Wafer Taper Specifications：
|
Wafer Size |
Diameter:4”, 6” & 8” Thickness:300 ~ 725 um |
|
Wafer Type |
Si , GaAsSingle Flat, Double Flat or V-Notch |
|
Tape Type |
Blue Tape or UV Tape Width:120 ~ 240 mm Length:100m Thickness:0.03 ~ 0.2 mm |
|
Taping Chuck Temp. |
Room Temp. ~ 100 °C Controllable (Optional) |
|
Cutting System |
Multi-Axis Fine Precision Profile Cutter; edge cutter heater, up to 120℃ |
|
Wafer Place Accuracy |
X-Y: +/- 0.2 mm Θ : +/- 0.2° |
|
Input & Output |
Single Input Wafer Cassette / Single Output Wafer Cassette Customer Specified (Sample Supply) |
|
ESD Control |
Ion Blower |
|
Wafer Robot |
JEL Wafer Robot Wafer Position & Warpage Intelligent Mapping in Cassette |
|
Wafer Alignment |
JEL Alignment |
|
Control Unit |
Standard Industrial PC with 17” Touch Panel LCD,Windows7/10 ProO/S |
|
Power Supplier |
ingle Phase AC 220 V, 20A |
|
Air Supplier |
60 PSI CDA, 2.5 CFM |
|
Conversion Time |
<= 15 Minutes |
|
Dimensions |
1300 mm (W) ×1500mm(D) ×1800mm(H) |
|
Machine Construction |
Made of Full Aluminium Profile |
|
Net Weight |
600 Kg around (Specifications items update without notice) |
