Home Page    Semiconductor    Wafer laminating machine    SINTAIKE STK-6150 Floor-standing advanced automatic wafer thinning and laminating machine Wafer Taper
1

SINTAIKE STK-6150 Floor-standing advanced automatic wafer thinning and laminating machine Wafer Taper

STK-6150 floor-standing advanced automatic wafer thinning and laminating machine features:

  • Patented flexible roller film
  • Spring knife system
  • Suitable for 8 "-12" wafers.

 

Performance of STK-6150 floor-standing advanced automatic wafer thinning and laminating machine;

Wafer yield

≥99.9%

Film pasting quality No bubbles (excluding dust particle bubbles)
Hourly capacity ≥ 75 wafers

MTBF

> 168 hours

MTTR

< 1 hour
down time

<3%

Product replacement time: ≤ 10 minutes

 

Specification parameters of STK-6150 floor-standing advanced automatic wafer thinning and laminating machine;

Wafer size

8”-12”wafer

Wafer thickness

300~750micron

Wafer type Silicon, gallium arsenide or other materials
Film type

Blue film or UV film (adhesion ≤8N/20mm)

Width: 240 ~ 340mm

Length: 100m

Thickness: 0.05 ~ 0.2mm.

Film sticking principle Anti-static roller film, roller pressure adjustable.
Wafer platen

General (integrated) Teflon anti-static coating contact table

The platen can be heated: room temperature ~100℃

Manual lifting of table and tray

Loading and unloading mode Manual placement and removal of wafers
Antistatic control Anti-static Teflon coated wafer table/anti-static film roller/anti-static ion fan
Cutting system

Automatic cutter, 8 "-12" without cutting V notch function, and the cutter can be heated at room temperature ~120℃.

Life management of cutting knife

Waste film treatment Automatic collection
Film pasting accuracy

X-Y:±0.5mm;θ:±0.5°

Wafer positioning Pneumatic pin positioning
control unit Based on PLC control, 10.1 "touch screen.
Safety protection Configure safety light curtain and emergency stop button.
Power supply voltage Single-phase alternating current 220V,16A
compressed air 5 kg of clean and dry compressed air with a flow rate of 100 l/min.
machine casing White plastic-sprayed metal shell
volume 850 mm (width) *1450 mm (depth) *1700 mm (excluding lamp height)
net weight 475 kg

Product Center

PRODUCT