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SINTAIKE STK-5150 Advanced semi-automatic wafer tearing machine Wafer Detaper
SINTAIKE STK-5150 Advanced semi-automatic wafer tearing machine Wafer Detaper
STK-5150 advanced semi-automatic wafer tearing machine features:
- Suitable for 8 "&12" wafers.
- easy to operate
Performance of STK-5150 advanced semi-automatic wafer tearing machine;
| Wafer yield |
≥99.9% |
| Tearing film quality | No lobes |
| Hourly capacity | ≥ 80 wafers |
| Product replacement time | ≤ 5 minutes |
| Wafer size | 8 "&12" wafer |
| thickness | 150 ~750 microns |
| Wafer type | Silicon, gallium arsenide; Flat edge or V-notch wafer |
| Tearing film type |
Tearing tape Width: 100~150 mm Length: 100m |
| Tearing angle | < 45 degrees, and can be adjusted from 5 degrees to 45 degrees. |
| Tearing temperature tearing temperature | The range from room temperature to 100℃ is adjustable, and the temperature control accuracy is +/-3℃ |
| Wafer platen |
General anti-static Teflon coated contact metal table With controllable heating function, the temperature can reach up to 100℃ Desk with vacuum suction function |
| Loading and unloading mode | Manual placement and removal of wafers |
| Antistatic control | ion fan |
| Wafer positioning | Spring pin positioning |
| control unit | Based on PLC control and equipped with 5.7 "touch screen. |
| Drive unit | Servo motor drive |
| Safety protection | Configure the emergency stop button |
| Power supply voltage | Single-phase alternating current 220V, 10A |
| compressed air | 5 kg of clean and dry compressed air with a flow rate of 80 liters per minute. |
| machine casing | White plastic-sprayed metal shell |
| Machine indication | Three-color lighthouse shows the working state of the machine. |
| volume | 950 mm (width) x1500 mm (depth) x1800 mm (including lighthouse height) |
| net weight | 300 kilograms |
