SINTAIKE Wafer Debonding series

Introduction of Wafer Debonding machine wafer de bonding series;

• Wafer debinding machine is applied to wafer temporary bonding/debinding process.

Features of Wafer Debonding machine wafer de bonding series:

• 4 "-8"/8 "-12" wafers are suitable for unbonding thin wafers.
• Unbonding machine intelligently maps wafers in the basket, which is compatible with loading and unloading of wafer basket and wafer box.
• The debinding machine can automatically correct the bonded wafer.
• You can customize vacuum hot pressing /UV/ laser to realize Wafer Debonding.
• The wafer debonding machine is equipped with a high-precision manipulator, which can automatically tear off the adhesive film used for temporary bonding of wafers.
• The debinding machine can automatically attach a dicing film to the wafer.
• Optional embedded ultraviolet irradiation module.
• Industrial computer +Windows system.
• SECS/GEM or simple networking capability.