OKAMOTO GNX200BP Wafer thinning and polishing machine
OKAMOTO GNX200BP wafer grinding/wafer thinning features:
GNX200BP is a continuous downward feed thinning equipment, which uses a mechanical arm to transfer silicon wafers. After thinning, there are two independent cleaning chambers, and the cleaning effect is better. The rotating speed of working disc, spindle and spindle can be adjusted, which is helpful to balance the output, reduce the quality and prolong the service life of grinding wheel. A two-point real-time thickness gauge is used to measure the thickness of silicon wafers under spindle 1 and spindle 2, and a three-point spindle angle adjustment mechanism is used to control the processing flatness (TTV). After the thinning process is completed, the silicon wafer will be automatically transferred to the polishing chamber. After the polishing process, the surface damage of the silicon wafer will be removed and the wafer strength will be improved. The thinnest wafer can be processed to 50μm m..
OKAMOTO GNX200BP wafer grinding/wafer thinning specifications:
| Maximum wafer size supported | 8 inches |
| Spindle form | Air spindle, up to 3600rpm |
| Spindle drive motor power |
2.2kW/4kW |
| Grinding wheel diameter |
250mm |
| Number of workstations | 3 work tables |
| Table form | Mechanical shaft bearing (standard) or air bearing (optional) |
| Table speed |
1-600rpm |
| Thickness measuring mechanism | 2-point contact thickness measuring mechanism |
| Thickness measurement accuracy |
1um |
| Thickness measuring range |
0-1.2mm |
| Number of magazines | 2 magazines for each work unit (thinning & polishing) |
| Polishing mechanism power |
3kW Ac servo motor (0-460rpm) |
| Polishing wave velocity | 100-8000mm/min |
| Polishing pressure | 50-999g/cm2 |
| Polishing wheel size | 200mm |
| Polishing table speed | 50-200rpm |
| Vacuum disk material | Alumina frame+ceramic blowhole disk |
| Self cleaning mode | Water flushing+brushing |
