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NAGOYA NXI-3300

Brief introduction to the characteristics of Nagoya Nagoya NXI-3300 online 3DX-ray automatic inspection machine;

  • Automatic inspection function solder defect inspection
  • Online scanning mode
  • Online scanning and high-speed image acquisition, wide range, high speed, full inspection of both facial products.
  • Nagoya Motor obtains images by linear scanning alone.
  • Compared with the previous regional scanning method, the field of view is larger and less affected by the size of the substrate.
  • It not only reduces the moving time of the mechanical mechanism, but also improves the accuracy.
  • The whole substrate can be monitored to meet the requirements of comprehensive inspection of the substrate.
  • Nxi-3300 can inspect all substrates on line for 75 seconds at the shortest.
  • The resolution can be changed freely between 12μm and 30μm, which provides more use schemes according to the situation.
  • Expand the CAD data to realize comprehensive inspection. By expanding the CAD data and obtaining the coordinates of related parts, automatic inspection can be implemented.
  • By analyzing the tomographic images, defects can be quickly identified.
  • Inspection of parts, which can detect the warping defect by comparing with the preset inspection benchmark.
  • BGA general patch parts can be inspected at the same time, except BGA, CSP and other pin parts, the patch parts can also be inspected automatically.
  • Internal welding of pins that cannot be confirmed by visual inspection can also be easily matched, which is especially suitable for industries that require high reliability, such as automobile electronics industry.

 

 

Specifications and parameters of Nagoya Nagoya NXI-3300 online 3DX-ray automatic inspection machine;

On-line 3DX-ray automatic inspection equipment NXI-3300 Main specifications:
Corresponding workpiece size W80×L50~W510×L460mm
Check the workpiece field W80×L30~W510×L440mm
Corresponding workpiece thickness 0.4-3.0mm
Corresponding workpiece weight Below 4.0kg
Part height Above the substrate: 40mm/ below the substrate: 30mm.
Automatic inspection project Solder balls of bottom electrode components (BGA, CSP, LGA, QFN): solder ball shape, foreign body, falling off, bridging, solder joints of parts with offset position (triode, capacitor, resistor) and lead parts (QFP, SOP): too much solder, too little solder, no solder, tilting and bridging.
On-line 3DX-ray automatic inspection equipment NXI-3300 system specification;
X-ray generator Closed microfocus
tube voltage 40-100kv
Tube current 0-200μA
Focus size 7μm
X-ray detector Linear scanner
resolution ratio 12-30μm
air pressure 0.4-0.5MPa
Power supply voltage AC 200/208/220/230/240V, 10% three-phase.
Consumption voltage Below 7.0kVA
Environmental conditions of use The ambient temperature is 10-35℃ and the humidity is 35-80%RH (no condensation).
X-ray leakage Less than 0.5μSv/h
Overall dimensions/weight W1890×D2560×H1800mm, about 3500kg.

 

 

Online 3DX-ray automatic inspection equipment NXI-3300 Optional functions:

  • Through system transmission, the tomographic images obtained during PC automatic inspection can be confirmed and edited for defective parts.
  • 3D synthesis software can edit and synthesize X-ray tomographic images.

 

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