NAGOYA NXI-3700
Brief introduction of characteristics of Nagoya Nagoya NXI-3700 semiconductor 3DX-ray ultra-high resolution automatic inspection machine;
- Automatic inspection function Copper electroplating inspection C4 solder ball inspection in Through hole
- Open nano-focus X-ray tube voltage: 20kV-160kV Minimum resolution: 0.25μm m.
- FPD 6 million pixels/1.18 million pixels Resolution: 0.25 μ m-10 μ m/0.25-23.5 μ m.
- Inclined CT mode
Specifications of Nagoya Nagoya NXI-3700 semiconductor-grade 3DX-ray ultra-high resolution automatic inspection machine;
| project | parameter |
| Corresponding workpiece size | W50×L50~W515×L610mm |
| Check the workpiece field | W475×L570mm |
| Corresponding workpiece thickness | 0.1-0.3mm |
| Corresponding workpiece weight | Below 2.0kg |
| Part height | 40mm on the substrate |
| X-ray generator | Open nano-focus |
| tube voltage | 20-160kv |
| Tube current | 0-200μA |
| Minimum resolution | 0.25μm |
| X-ray detector | Vertical: FPD 600 million pixels/tilt: 118 million pixels |
| resolution ratio | Vertical: 0.25-10μm/ Tilt: 0.25-2.5μm m. |
| air pressure | 0.5MPa |
| Power supply voltage | Ac 220v 10%, single phase 50/60Hz. |
| Consumption voltage | Below 10kVA |
| Environmental conditions of use | |
| ambient temperature | 22℃±2℃ |
| humidity | 50% 10% RH (no condensation) |
| Bed vibration | The amplitude is below 2 μ m. |
| X-ray leakage | Less than 0.5μSv/h |
| outline dimension | W1780×D2530×H2000mm |
| weight | About 7500kg |
Optional functions of Nagoya online 3DX-ray automatic inspection equipment NXI-3700
- The tomographic images obtained during PC automatic inspection are obtained through system transmission, and the defective parts can be confirmed and edited.
- 3D synthesis software can edit and synthesize X-ray cross-sectional pictures.
NXI-3700 is the world's highest level of performance 3D CT X-ray.
Ultra-high performance device with independent software to realize the highest realm image
Nano-X-ray tube (minimum resolution: 0.25μm) with high sensitivity 1.1. Examiner (resolution: 0.25μ m-2.5μ m), high image quality, unparalleled.
Cooperate with brand-new image change rate software to obtain unique X-ray images.
NXI-3700 adopts high repetition test precision to ensure accurate data.
Newly designed rigid structure with high-precision linear motor and full-effect supplementary software can meet the high-speed and wide-range mobile positioning accuracy.
The self-contained airbag design can effectively avoid external influences and achieve the highest repeated test accuracy in the world.
NXI-3700 can correspond to large substrates.
The unique tilting CT mechanism, combined with a 515×610mm large substrate, can meet the needs of CT scanning at any position.
The detection table is additionally provided with a vacuum adsorption function, so that the maximum 100μm safe positioning including the flexible substrate can be met, and effective and accurate CT scanning can be ensured.
High-precision and high-quality automatic inspection system
Independent development of automatic correction system, automatic height check and correction logic, YXZ correction logic to avoid errors in detection, restore real images, achieve the highest level of precision detection, and meet the needs of semiconductor industry.
Copper electroplating inspection in Though hole
The electroplating and filling status of copper in the through hole (TH) in the substrate is automatically confirmed. Void defects of several μm can also be detected automatically.
C4 solder ball inspection can automatically identify defects such as welding condition, solder ball shape and void by analyzing fault images.
