Home Page    checkout equipment    Solderability tester    MALCOM SWB-2
2

MALCOM SWB-2

summary

Brief introduction of characteristics of MALCOM SWB-2 wetting balance tester;

From spraying flux (with flux temperature adjustment function) to the end of the test, the instability of artificial test can be reduced by adopting automatic test.

It can be tested according to JISZ3198 (lead-free flux test method) wet balance test method.

Solder can be changed at will, and flux can be exchanged.

Using electric balance sensor, very weak force can be detected.

By connecting with a computer, the attached software can be used for testing and analysis (option).

By installing a plastic cover, the test can be carried out in nitrogen (option)

Measurement of micro-wetting balance measurement method can be carried out (option)

Testing method of MALCOM SWB-2 wetting balance tester;

Standard: solder bath balance method

Optional: solder ball method

 

parameter

 

Specification parameters of Malcom SWB-2 wetting balance tester:

load cell

Principle: Electronic Balance Sensor (EBS)

Measurement range: 30mn ~-30mn

Determination accuracy: ±0.05mN

Resolution: 0.01mN

temperature sensor

Temperature range: 0 ~ 450℃

Determination accuracy: 3℃

Infiltration time

1~200s

Infiltration depth 0.01 ~ 20.00 mm (0.01 mm step)
Infiltration velocity

0.1~30mm/s

Solder temperature setting Normal temperature ~ 400℃ (normal temperature ~ 320℃ when microelectronics are wetted)
Corresponding specifications (Japan)

Automatic determination (spraying flux, removing and determining)

JIS Z3198-4 and c60068-2-54, c6008-2-69 jeita et 7411 (solder bath)

Corresponding specifications (overseas)

ISO 9455-16

IEC 60068-2-54 and 60068-2-69(Solder bath)

ANSI J-STD-003, MIL-STD-883(METHOD 2022.2) 

And IPC-TM-650(2.4.14.2)

N2 determination Oxygen concentration: below 500ppm (option)
Power Supply Small thermocouple
Device size

W300×D330×H370 (mm)

weight

16kg


 

Product Center

PRODUCT